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Europe’s Semiconductor Resilience – The Gaps Behind the Policy Goals

Published in EE Times Europe, November 2025 (Geopolitics of Semiconductors Issue)

SourceArcSemi Insights - 1 min read

Colorful silicon wafers symbolizing Europe’s semiconductor resilience – EE Times Europe feature by Christoph H. X. Gnadl

Introduction

Europe’s €43 billion Chips Act aims to secure supply chains and technological sovereignty — yet resilience is built on more than new fabs. In this article, Christoph H. X. Gnadl outlines why operational preparedness inside OEMs, demand transparency across tiers, and better-aligned incentives will define Europe’s next semiconductor test.

👉 Read the full article in EE Times Europe (November 2025):

• Online version: Europe’s Semiconductor Resilience: Gaps Behind the Policy Goals - EE Times
• PDF magazine (pages 23–24): EE Times Europe Magazine – November 2025
(Please note: link opens the official EE Times Europe magazine site)

Key takeaways

- Structural overreliance on mature-node capacity (40–180 nm) persists.

- Demand transparency remains fragmented across OEMs, Tier-1s and suppliers.

- Resilience depends on cross-functional planning and long-horizon supplier partnerships — not fab capacity alone.

Why this matters

Europe’s industrial and automotive leaders can mitigate the next supply-chain shock by linking internal S&OP, supplier strategies, and program management to realistic semiconductor lifecycle dynamics — especially at mature nodes.

Author’s note

This contribution builds on engagements with European industrial and automotive clients.
If you want to map your semiconductor exposure and derive actionable resilience measures — from identifying critical dependencies and enabling demand-driven allocation control to developing coordinated second-source strategies — feel free to contact us.

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